Research
subject |
Improve
Soldering badness |
Research
institute |
Technology-laboratory
of JM Telecom(corp.) |
Research
background |
There is 10,344 PPM failure of SOLDERING in SMT process occurring 96 million won for quality cost year on year.
This SOLDERING failure results in the Field claim causing decreasing client reliance and order. The purpose is to solve this problem. |
Research
result
|
Improving
purpose and requirements
Components should be matched for installmentt
Componets should not be damaged
Alien-substances should not exist
Solder’s 빠짐성 should be good
|
Applied technology
Analysis technology to interpret the measurement system
Analyze Gage R&R
Change and standardize the design of Metal Mask
Standardize the size according to the main(major) components
Standardize the durability management of Soldering Tool Jig
|
Research
Result
Decrease the badness of Soldering, 10.344ppm by 5,172 |
Developing
period |
From April, 2005 to August,
2005 |
Expected
effects |
Reduce the quality-cost
by 55000000won(5thousand-5 million won) |
